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| www.fairchildsemi.com FAN1112 1A 1.2V Low Dropout Linear Regulator Features * * * * * * Low dropout voltage Load regulation: 0.05% typical Trimmed current limit On-chip thermal limiting Standard SOT-223 and TO-252 packages Three-terminal fixed 1.2V Description The FAN1112 is a 1.2V low dropout three-terminal regulator with 1A output current capability. The device has been optimized for low voltage where transient response and minimum input voltage are critical. Current limit is trimmed to ensure specified output current and controlled short-circuit current. On-chip thermal limiting provides protection against any combination of overload and ambient temperatures that would create excessive junction temperatures. Unlike PNP type regulators where up to 10% of the output current is wasted as quiescent current, the quiescent current of the FAN1112 flows into the load, increasing efficiency. The FAN1112 regulator is available in the industry-standard SOT-223 and TO-252 (DPAK) power packages. Applications * Post regulator for switching supplies * Supply for low-voltage processors Typical Application FAN1112 VIN = 3.3V 10F GND + VIN VOUT + 22F 1.2V at 1A REV. 1.0.1 9/27/01 PRODUCT SPECIFICATION FAN1112 Pin Assignments Front View Tab is VOUT Front View 3 Tab is VOUT 2 1 IN OUT GND GND OUT 4-Lead Plastic SOT-223 JC = 15C/W* IN 1 2 3 3-Lead Plastic TO-252 JC = 3C/W* *With package soldered to 0.5 square inch copper area over backside ground plane or internal power plane., JA can vary from 30C/W to more than 50C/W. Other mounting techniques may provide better thermal resistance than 30C/W. Absolute Maximum Ratings Parameter VIN (VIN - VOUT) * IOUT Operating Junction Temperature Range Storage Temperature Range Lead Temperature (Soldering, 10 sec.) 0 -65 Min. Max. 18 See Figure 1 125 150 300 C C C Unit V 1.2 1.0 IOUT (A) 0.8 0.6 0.4 0.2 0 0 2 4 6 8 10 VIN - VOUT (V) 12 14 16 18 20 Figure 1. Absolute Maximum Safe Operating Area 2 REV. 1.0.1 9/27/01 FAN1112 PRODUCT SPECIFICATION Electrical Characteristics Operating Conditions: VIN 7V, TJ = 25C unless otherwise specified. The * denotes specifications which apply over the specified operating temperature range. Parameter Output Line Voltage3 Conditions 10mA IOUT 1A FAN1112, 3.0V VIN 7.2V 3.0V VIN 12V, IOUT = 10mA (VIN - VOUT) = 2V, 10mA IOUT 1A VREF = 1%, IOUT = 1A (VIN - VOUT) = 2V 3.0V VIN 7V, 10mA IOUT 1A 3.0V VIN 15V VIN = 7V f = 120Hz, COUT = 22F Tantalum, (VIN - VOUT) = 3V, IOUT = 1A TA = 25C, 30ms pulse * TA = 125C, 1000hrs. TA = 25C, 10Hz f 10kHz * * * * * * * * * 60 10 4 72 0.004 0.5 0.03 0.003 15 3 155 10 1.0 0.02 13 1.1 Min. 1.140 Typ. 1.200 0.005 0.05 1.100 1.5 35 0.2 120 5 Max. 1.260 0.2 0.5 1.200 Units V % % V A A A mA mA dB %/W % % % C/W C/W C C Regulation1,2 Regulation1,2 Load Dropout Voltage Current Limit GND Pin Current GND Pin Current Change Minimum Load Current Quiescent Current Ripple Rejection Thermal Regulation Temperature Stability Long-Term Stability RMS Output Noise (% of VOUT) Thermal Resistance, Junction SOT-223 to Case TO-252 Thermal Shutdown Thermal Shutdown Hysteresis Junction Temperature Notes: 1. See thermal regulation specifications for changes in output voltage due to heating effects. Load and line regulation are measured at a constant junction temperature by low duty cycle pulse testing. 2. Line and load regulation are guaranteed up to the maximum power dissipation (18W). Power dissipation is determined by input/output differential and the output current. Guaranteed maximum output power will not be available over the full input/ output voltage range. 3. Output current must be limited to meet the absolute maximum ratings of the part. REV. 1.0.1 9/27/01 3 PRODUCT SPECIFICATION FAN1112 Typical Performance Characteristics DROPOUT VOLTAGE DEVIATION (%) 1.5 1.4 DROPOUT VOLTAGE (V) 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0 0 0.2 0.4 0.6 0.8 1.0 TJ = 25C TJ = 125C TJ = 0C 0.10 0.05 0 -0.05 -0.10 -0.15 -0.20 -75 -50 -25 0 I = 1A 25 50 75 100 125 150 175 OUTPUT CURRENT (A) JUNCTION TEMPERATURE (C) Figure 2. Dropout Voltage vs. Output Current 1.225 Figure 3. Load Regulation vs. Temperature 5 MINIMUM LOAD CURRENT (mA) 1.220 OUTPUT VOLTAGE (V) 1.215 1.210 1.205 1.200 1.195 1.190 1.185 1.180 1.175 -75 -50 -25 0 25 50 75 100 125 150 175 4 3 2 1 0 -75 -50 -25 0 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (C) JUNCTION TEMPERATURE (C) Figure 4. Reference Voltage vs. Temperature Figure 5. Minimum Load Current vs. Temperature 100 SHORT-CIRCUIT CURRENT (A) 25 50 75 100 125 150 175 90 ADJUST PIN CURRENT (A) 80 70 60 50 40 30 20 10 0 -75 -50 -25 0 2.0 1.75 1.5 1.25 1.0 -75 -50 -25 0 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (C) JUNCTION TEMPERATURE (C) Figure 6. GND Pin Current vs. Temperature Figure 7. Short-Circuit Current vs. Temperature 4 REV. 1.0.1 9/27/01 FAN1112 PRODUCT SPECIFICATION Typical Performance Characteristics (continued) 90 80 RIPPLE REJECTION (dB) 70 POWER (W) 60 50 40 30 20 10 0 10 (VIN - VOUT) = 3V 0.5 < VRIPPLE < 2V IOUT = 1A 100 1K 10K 100K 7.5 TO-252 5 10 2.5 SOT-223 0 25 45 65 85 105 125 FREQUENCY (Hz) CASE TEMPERATURE (C) Figure 8. Ripple Rejection vs. Frequency Figure 9. Maximum Power Dissipation REV. 1.0.1 9/27/01 5 PRODUCT SPECIFICATION FAN1112 Mechanical Dimensions 4-Lead SOT-223 Package Symbol A A1 B c D E e F H I J K L M N Inches Min. -- -- .025 -- .248 .130 .115 .033 .264 .012 -- 10 .0008 10 .010 Max. .071 .181 .033 .090 .264 .148 .124 .041 .287 -- 10 16 .0040 16 .014 Millimeters Min. -- -- .640 -- 6.30 3.30 2.95 .840 6.71 .310 -- 10 .0203 10 .250 Max. 1.80 4.80 .840 2.29 6.71 3.71 3.15 1.04 7.29 -- 10 16 .1018 16 .360 Notes D e K A H E B A1 c F J M I L N 6 REV. 1.0.1 9/27/01 FAN1112 PRODUCT SPECIFICATION Mechanical Dimensions (continued) 3-Lead TO-252 Package Symbol A b b2 b3 c c2 D E e H L L1 L3 L4 Inches Min. .086 .025 .030 .205 .018 .018 Max. .094 .035 .045 .215 .024 .023 Millimeters Min. 2.19 0.64 0.76 5.21 0.46 0.46 Max. 2.39 0.89 1.14 5.46 0.61 0.58 4 Notes: Notes 1. 2. 3. 4. 5. 1 1 6. Dimensions are exclusive of mold flash, metal burrs or interlead protrusion. Stand off-height is measured from lead tip with ref. to Datum -B-. Foot length is measured with ref. to Datum -A- with lead surface. Thermal pad contour optional within dimension b3 and L3. Formed leads to be planar with respect to one another at seating place -C-. Dimensions and tolerances per ASME Y14.5M-1994. .210 .245 .250 .265 .090 BSC .370 .410 .055 .070 .108 REF .035 .025 .080 .040 5.33 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.89 0.64 2.03 1.02 3 4 E @PKG/ @HEATSINK b3 L3 c2 D H b2 E-PIN L4 L1 L b e = 0 - 10 -A- -B- A -C- REV. 1.0.1 9/27/01 7 PRODUCT SPECIFICATION FAN1112 Ordering Information Product Number FAN1112D FAN1112S Package TO-252 SOT-223 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. www.fairchildsemi.com 9/27/01 0.0m 007 Stock#DS30001112 2001 Fairchild Semiconductor Corporation 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. |
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